What you do at AMD changes everything

At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center.

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results. It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world. If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

The Person:

Strong design engineer with proven abilities of delivering complex, high quality, and high velocity package designs. Excellent organizational skills and self-starter in identifying and solving engineering problems.

Key Responsibilities:

• Development and ownership of package design rules that meet substrate manufacturing, package assembly & test, and yield & reliability requirements
• Interface with stakeholder and experts in manufacturing process, architects, computational modelling and other associated areas
• Conduct Design Failure Mode Effect Analysis and derive optimal data collection strategy and propose Test Vehicle, Test Chip, and modelling needs
• Design and develop Test Vehicle package, Test Chips, Test SOICs, and chip modules
• Develop optimal design flows and methods for emerging package architectures – DFX (Design for Performance, Manufacturability, Assembly, Yield, Testability)

Preferred Experience:

• Multi years of Package Design Experience
• Knowledge in 2.5D and 3D architectures – WLFO, CoW, and other stacked die architectures
• Well versed in Design Tools and Infrastructure ECAD and MCAD – Mentor Xpedition, APD, SolidWorks, NX, Creo, AutoCAD
• Develop scripted/programmatic solutions for design problems

Academic Qualification:

Bachelors/Masters/PhD in mechanical, electrical, chemical, or material engineering

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Requisition Number: 168688
Country: United States State: Texas City: Austin
Job Function: Packaging Engineering

Benefits offered are described here.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information.